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august 2010 doc id 16910 rev 1 1/11 11 EMIF06-MSD02C3 mini and micro-sd card ipad? emi filtering and esd protection features emi low-pass filter esd protection 15 kv (iec 61000-4-2) integrated pull up resistors to prevent bus floating when no card is connected 50 mhz clock frequency compatibility with c line < 20 pf low power consumption easy layout thanks to smart pin-out configuration very low pcb space consuming high reliability offered by monolithic integration reduction of parasitic elements thanks to csp integration lead-free package complies with the following standards: iec 61000-4-2 level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) mil std 883g - method 3015-7 class 3a sd specification part 1, physical layer specification, version 2.0 application mini and micro (t-flash) secure digital memory card in: mobile phones communication systems figure 1. pin configuration (bump side) description the EMIF06-MSD02C3 is a highly integrated device based on ipad technology offering two functions: esd protection to comply with iec standard, and emi filtering to reject mobile phone frequencies. tm: ipad is a trademar k of stmicroelectronics flip chip (16 bumps) 1 2 3 4 d c b a www.st.com
characteristics EMIF06-MSD02C3 2/11 doc id 16910 rev 1 1 characteristics figure 2. EMIF06-MSD02C3 configuration table 1. absolute ratings (limiting values) symbol parameter value unit v pp esd discharge iec 61000-4-2, air discharge esd discharge iec 61000-4-2, contact discharge 15 15 kv v in maximum input voltage 5.5 v t j maximum junction temperature 125 c t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to + 150 c table 2. pin configuration pin signal pin signal a1 data0 c1 cmd a2 data1 c2 v ss a3 sddata1 c3 v ss a4 sddata0 c4 sdcmd b1 clk d1 data3/cd b2 v cc d2 data2 b3 v ss d3 sddata2 b4 sdclk d4 sddata3/cd vcc sdclk sdcmd sddata0 sddata1 sddata2 sddata3/cd clk cmd data0 data1 data2 data3/cd r9 r1 0 r1 1 r1 2 r1 3 r1 r3 r5 r2 r3 r5 host card gnd bumps must be connected together
EMIF06-MSD02C3 characteristics doc id 16910 rev 1 3/11 table 3. electrical characteristic symbol test conditions min. typ. max. unit v br i r = 1 ma 14 16 v i rm v rm = 3 v 0.1 a r1, r2, r3, r4, r5, r6 tolerance 20 % 40 r10, r11, r12, r13 tolerance 30 % 56 k r9 tolerance 30 % 4.7 k c line v = 0 v, f = 1 mhz, v osc = 30 mv 15 20 pf figure 3. s21 attenuation measurements fi gure 4. analog crosstalk measurements 100.0k 1.0m 10.0m 100.0m 1.0g -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 data0 data1 data2 data3/cd cmd clk v bias =0 v db f (hz) 100.0k 1.0m 10.0m 100.0m 1.0g -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 data0-sddata1 data0-sddata3 v bias =0 v db f (hz) figure 5. esd response to iec 61000-4-2 (+15 kv air discharge) on clk and data lines figure 6. esd response to iec 61000-4-2 (-15 kv air discharge) on clk and data lines input output 20 v/div 5 v/div 100 ns/div input output 20 v/div 10 v/div 100 ns/div
characteristics EMIF06-MSD02C3 4/11 doc id 16910 rev 1 figure 9. digital crosstalk test setup figure 10. digital crosstalk figure 7. esd response to iec 61000-4-2 (+15 kv air discharge) on v cc line figure 8. esd response to iec 61000-4-2 (-15 kv air discharge) on v cc line v cl 10 v/div 100 ns/div v cl 10 v/div 100 ns/div ?t amb =25 c lecroy wavesurfer 64xs 600 mhz ? 2.5gs/s oscilloscope input line ?a? output line ?b? agilent pulse pattern generator 81110a input line ?b?: 50 & open v out =3 v t r =t f =2 ns (open) f=8.3 mhz direct input on 50 voltage probe lecroy hfp1000 100 k / 0.7 pf 50 50 sddata0 clk 100 mv/div 1 v/div 100 ns/div
EMIF06-MSD02C3 characteristics doc id 16910 rev 1 5/11 figure 11. step response test setup figure 12. step response without the filter figure 13. step response with the filter ?t amb =25 c lecroy wavepro 7300a 3 ghz ? 20 gs/s oscilloscope input line ?a? agilent pulse pattern generator 81110a v out =3 v t r =t f =2 ns (values set in open) f=8.3 mhz voltage probe lecroy hfp1000 (100 k - 0.7 pf) output line ?a? notes: - voltage amplitude set to 3v - total capacitance load 15 pf (5 pf for pcb parasitic capacitance and voltage probe capacitance, 10 pf for sdcard) c load =15 pf sddatax/cmd/clk c = 15 pf f = 52 mhz v = 3 v load 1 v/div 5 ns/div rise@lv = 885 ps, fall@lv = 886 ps 20% - 70% (sd standard) sddatax/cmd/clk c = 15 pf f = 52 mhz v = 3 v load 1 v/div 5 ns/div rise@lv = 1.705 ns, fall@lv = 2.426 ns 20% - 70% (sd standard)
characteristics EMIF06-MSD02C3 6/11 doc id 16910 rev 1 figure 14. junction capacitance versus reverse applied voltage (typical values) 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 01234 5 c1_cmd a1_data0 a2_data1 d2_data2 d1_data3 b1_clk c(pf) v (v) r f=10mhz v=30mv t=25c osc rms j
EMIF06-MSD02C3 technical information doc id 16910 rev 1 7/11 2 technical information figure 15. t-flash recommended connection pull-up resistances r dat and r cmd are included to prevent bus floating when no card is inserted or when all card drivers are in high impedance mode. the pull-up resistors and capacitors described in the above recommendation are integrated in the EMIF06-MSD02C3. this makes the EMIF06-MSD02C3 an easy "plug and play" solution to implement secured t-flash, mini-sd and micro-sd card terminations. figure 16. recommendation layout pin 1 pin 2 pin 3 pin 4 pin 5 pin 6 pin 7 pin 8 cmd r dat r cmd d a t0~3 clk c 1 c 2 c 3 host EMIF06-MSD02C3 clk dat 0 cmd dat 1 dat 2 vss vcc vcc gnd clk dat 0 cmd dat 1 dat3/cd dat 2 input output top level second le vel dat3/cd top view: gnd bumps must be connected together
ordering information scheme EMIF06-MSD02C3 8/11 doc id 16910 rev 1 3 ordering information scheme figure 17. ordering information scheme emif yy - xxx zz cx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10(pf) or 3 letters = application 2 digits = version c = coated flip chip x = 3: lead-free, pitch = 400 m, bump = 255 m
EMIF06-MSD02C3 package information doc id 16910 rev 1 9/11 4 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 18. package dimensions figure 19. footprint figure 20. marking 1.54 mm 40 m 1.54 mm 40 m 255 m 40 400 m 40 400 m 40 170 m 10 170 m 10 650 m 60 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y z w x w dot, st logo ecopack status xx = marking yww = datecode y = year, ww = week z = manufacturing location
ordering information EMIF06-MSD02C3 10/11 doc id 16910 rev 1 figure 21. tape and reel specification 5 ordering information note: more information is availa ble in the application notes: an2348: ?flip chip: package description and recommendations for use? an1751: "emi filters: recommendations and measurements" 6 revision history dot identifying pin a1 location user direction of unreeling all dimensions in mm 4.0 0.1 4.0 0.1 2.0 0.05 8.0 0.3 1.75 0.1 3.5 - 0.05 ? 1.55 0.05 0.73 0.05 1.68 0.05 0.20 0.02 st st st xxz yww xxz yww xxz yww e e e 1.68 0.05 st st st xxz yww xxz yww xxz yww e e e table 4. ordering information order code marking package weight base qty delivery mode EMIF06-MSD02C3 jp flip chip 3.2 mg 5000 tape and reel 7? table 5. document revision history date revision changes 12-aug-2010 1 first issue.
EMIF06-MSD02C3 doc id 16910 rev 1 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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